Laird Performance Materials Thermal Management and EMI Solutions in the Pacific Northwest | Technical Marketing, Inc.
Laird Performance Materials Thermal Management and EMI Solutions in the Pacific Northwest
Laird Performance Materials is a global leader in thermal interface materials and EMI shielding solutions used to manage heat, reduce signal interference, and improve long-term reliability in electronic design. Their portfolio includes gap fillers, phase change materials, thermal pads, liquid gap fillers, thermally conductive insulators, and shielding materials engineered for demanding applications.
As power densities increase and electronics become more compact, effective thermal management is critical. Laird materials help dissipate heat efficiently, maintain signal integrity, and extend product life across a wide range of industries.
TMI works closely with Laird field application engineers to support customers throughout the Pacific Northwest with material selection, thermal stack-up design, and application-specific recommendations. This collaboration allows us to deliver practical, engineering-driven solutions that improve performance and reduce design risk.
Whether you are designing next-generation electronics, solving thermal challenges, or optimizing an existing system, we provide direct access to both local support and Laird’s global engineering resources.
Key Applications and Industries
• AI and high-performance computing systems
• Data centers and cloud infrastructure
• Telecommunications and 5G equipment
• Medical electronics and diagnostic equipment
• Power electronics and energy systems
• Aerospace and defense electronics
• Industrial automation and control systems
Absorbers
RF absorber materials designed to suppress electromagnetic interference and improve signal performance in high-frequency electronic systems.
Inductive Components – EMC Components and Ferrite Cores
Ferrite cores and EMC components used to reduce noise and improve electromagnetic compatibility in electronic circuits.
PCB Component EMI Shielding & Grounding Contacts
PCB-level shielding and grounding solutions that enhance signal integrity and reduce electromagnetic interference.
Find the Finish Line Faster
Custom Precision Metal Stamping (EMI & Non-EMI)
Precision metal components engineered for EMI shielding and mechanical performance in electronic and industrial applications.
Inductive Components – Wireless Charging Coils
Wireless charging coils engineered for efficient inductive power transfer in consumer, medical, and industrial applications.
Semiconductor Assembly Materials
Materials engineered for semiconductor packaging, improving thermal performance, reliability, and device longevity.
Enclosure Level EMI Shielding
EMI shielding solutions that protect electronic enclosures from interference while supporting system compliance and reliability.
LED Silicone Materials
Silicone materials designed for LED applications, offering thermal stability, durability, and optical performance.
Thermal Interface Materials
Thermal materials designed to efficiently transfer heat and improve cooling performance in electronic systems.
Inductive Components – Inductors for Power & Signal Lines
Inductors designed for power conditioning, filtering, and signal integrity in industrial and electronic systems.
Multi-Function Solutions (MFS)
Integrated materials that combine EMI shielding, grounding, and thermal management for compact electronic designs.